发明名称 METHOD OF DETERMINING DEFECTS IN A SUBSTRATE AND APPARATUS FOR EXPOSING A SUBSTRATE IN A LITHOGRAPHIC PROCESS
摘要 <p>PURPOSE: A method for determining defects in a substrate and an apparatus for exposing a substrate in a lithography process are provided to determine existence of defects in the substrate, by detecting variations of fraction measured across the scan range. CONSTITUTION: An illuminator system(IL) is constituted to condition a radiation beam(B). A substrate table(WT) is constituted to keep a substrate(W). Scan range of the substrate is scanned using a sensor projecting the radiation beam on the substrate. Fraction of the intensity of the radiation reflected from different substrate regions following the scan range is measured. Variations of the fraction measured across the scan range are determined. Existence of defects in the substrate is determined from the variations.</p>
申请公布号 KR20090125010(A) 申请公布日期 2009.12.03
申请号 KR20090047698 申请日期 2009.05.29
申请人 ASML NETHERLANDS B.V. 发明人 SAHA NILAY;PEN HERMEN FOLKEN
分类号 H01L21/027 主分类号 H01L21/027
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