| 摘要 |
In an integrated circuit (10) having a plurality of modules (12-14) and/or submodules (32, 33, 36-39) that each perform a substantially same function, defective modules and/or submodules are determined by creating a test signature (64) from an input test pattern. The output (60) of each module and/or submodule is compared (68) with the test signature and defective modules to identify defective modules and/or submodules. The identity of defective modules/submodules is stored on the integrated circuit for subsequent use by a customer. Integrated circuits having one or more defective modules/submodules are sold (96) to customers with full disclosure of which modules/submodules are defective, thereby improving the yield associated with the product. Pricing of the product is discounted for products with less than full functionality.
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