| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to form a thin film layer on a core substrate and perform patterning of the thin film layer, thereby reducing a thickness and size of the printed circuit board. CONSTITUTION: An insulating core substrate(111) has a plurality of via holes passing through both sides. A conductive first thin film layer(121) is arranged in one side of the insulating core substrate. A conductive second thin film layer(122) is arranged in the other side of the core substrate. A first insulation layer(141) covers at least a part of the first thin film layer. A second insulation layer(142) covers at least a part of the second thin film layer. A plating layer(130) electrically connects the first thin film layer and the second thin film layer. A filler layer(143) fills the via hole of the core substrate.
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