| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition having excellent developability and a sufficiently high photosensitive characteristic, and further excellent in a bonding strength and reliability of a cured film, a photosensitive element using the same, a forming method for a resist pattern, and a bonding method for a member to be bonded. <P>SOLUTION: This photosensitive adhesive composition contains (A) a polybenzoxazole precursor expressed by General Formula (1) where U or V represents a divalent organic group, at least one of the U or V is a group containing 1-30C aliphatic chain structure, or at least one of the U or V is a group expressed by General Formula (2), and where R<SP>1</SP>and R<SP>2</SP>respectively are independently a trifluoromethane and a is 1-30 of integer, in the General Formula (2), (B) a photopolymerizable compound having an ethylenic unsaturated group in its molecule, (C) a photopolymerizable initiator, and (D) an epoxy resin. <P>COPYRIGHT: (C)2010,JPO&INPIT |
