| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide substrates allowed to share specifications without increasing restrictions on elements, a method for manufacturing substrates, a semiconductor device, and a method for manufacturing a semiconductor device. <P>SOLUTION: A substrate for fixing an IC element 51 and a passive element 52 includes a top surface and a bottom surface and includes a plurality of posts 15 arranged so as to form a plurality of columns in a longitudinal direction and a plurality of rows in a lateral direction in a plane view, and each post 15 includes a first area 15a and a second area 15b projecting from the first area 15a in a plane view, in a top surface. This configuration allows substrates to share specifications without restrictions on layout (arrangement positions) of pad terminals of many kinds of elements, and highly versatile substrates is provided. When the passive element 52 is attached to the first area 15a of the post 15, a space not covered with a fillet 24' is easily secured in the second area 15b. <P>COPYRIGHT: (C)2010,JPO&INPIT |
