FABRICATION PROCESS FOR A THICK FILM BY MAGNETRON SPUTTERING

摘要

Disclosed is a fabrication process for a thick film by magnetron sputtering.  The thick film fabrication process comprises: forming, over a substrate, a first thin film having a compressive residual stress using a magnetron sputtering method; forming, over the first thin film, a second thin film having a tensile residual stress using a magnetron sputtering method; repeating the deposition of the first and second thin films at least once to deposit a thin film having an overall residual stress controlled within a predetermined range.  With this fabrication process for a thick film, the overall stress of a thick film can be controlled to fall within an allowable range, and a thick film can be made of a homogenous substance as well as heterogeneous substances.