COPPER CLAD LAMINATE, SURFACE TREATED COPPER FOIL USED FOR MANUFACTURING THE SAME, AND PRINTED WIRING BOARD MANUFACTURED USING THE SAME

摘要

PURPOSE: A copper clad laminate, a surface-treated copper foil therefor, and a printed wiring board manufactured using the same are provided to produce a flexible print wiring board having no undercut phenomenon on the bottom of a printed circuit. CONSTITUTION: A copper clad laminate is formed by bonding a copper layer and an insulating resin layer. A surface treatment layer(3) having transition metal component except zinc is formed on an interface of the copper layer and the insulating resin layer. The surface roughness of the interface of the copper layer and insulating resin layer are 2.5μm or less. The mass thickness of the surface treatment layer is 2.5μm or less. A printed wiring board forms a wiring circuit with the copper clad laminate.