| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a nonflammable adhesive resin composition, which has high heat resistance and contains substantially no halogen element, and in particular, is suitable for a flexible printed circuit board, an adhesive film using the nonflammable adhesive resin composition, a cover lay film, and a flexible copper-clad laminate. <P>SOLUTION: The nonflammable adhesive resin composition comprises (α) an epoxy resin, (β) a curing agent, (γ) an accelerator, (δ) a carboxyl group-containing phenoxy resin represented by a general formula (1), and (ε) an organophosphorus compound or a phosphorus-containing resin solid at ordinary temperature as essential constituents, and contains substantially no halogen element. In the formula, X is, for example, a substituted phenyl group-containing divalent group, Z is a hydrogen atom or a glycidyl group, and A is, for example, a carboxyl group-containing monovalent group. <P>COPYRIGHT: (C)2010,JPO&INPIT |
