发明名称 SURFACE ACOUSTIC WAVE DEVICE, COMMUNICATION FILTER AND MOBILE COMMUNICATION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface acoustic wave (SAW) device capable of forming fine electrodes, with a relatively thin film thickness, from low-priced materials. Ž<P>SOLUTION: In a SAW device with interdigital electrodes 5-7 formed on a piezoelectric substrate, a main component of electrode materials forming the interdigital electrodes 5-7 is copper, the piezoelectric substrate is an approximate 15° rotary Y-axis cut X-direction propagation LiNbO<SB>3</SB>substrate, and a SAW propagation mode is a Love-wave mode. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009284554(A) 申请公布日期 2009.12.03
申请号 JP20090203756 申请日期 2009.09.03
申请人 HITACHI MEDIA ELECTORONICS CO LTD 发明人 YAMAGUCHI MASATSUNE;HASHIMOTO KIYONARI;OMORI TATSUYA;ASANO HIRONORI
分类号 H03H9/25;H01L41/09;H01L41/18;H03H9/145;H03H9/64 主分类号 H03H9/25
代理机构 代理人
主权项
地址
您可能感兴趣的专利