发明名称 |
SURFACE ACOUSTIC WAVE DEVICE, COMMUNICATION FILTER AND MOBILE COMMUNICATION APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface acoustic wave (SAW) device capable of forming fine electrodes, with a relatively thin film thickness, from low-priced materials. Ž<P>SOLUTION: In a SAW device with interdigital electrodes 5-7 formed on a piezoelectric substrate, a main component of electrode materials forming the interdigital electrodes 5-7 is copper, the piezoelectric substrate is an approximate 15° rotary Y-axis cut X-direction propagation LiNbO<SB>3</SB>substrate, and a SAW propagation mode is a Love-wave mode. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2009284554(A) |
申请公布日期 |
2009.12.03 |
申请号 |
JP20090203756 |
申请日期 |
2009.09.03 |
申请人 |
HITACHI MEDIA ELECTORONICS CO LTD |
发明人 |
YAMAGUCHI MASATSUNE;HASHIMOTO KIYONARI;OMORI TATSUYA;ASANO HIRONORI |
分类号 |
H03H9/25;H01L41/09;H01L41/18;H03H9/145;H03H9/64 |
主分类号 |
H03H9/25 |
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地址 |
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