| 摘要 |
PURPOSE: Provided is an ink composition for solder resist using polycarboxylic acid resin containing tetraphenolethane novolac type unsaturated group, as a binder polymer. The solder resist coating has not only excellent adhesiveness to a copper-plated laminate also good resistance to lead solder heat, and thus it applicable as insulation materials, impregnating materials, paints and adhesives. CONSTITUTION: The composition comprises binder polymers, hardeners, photopolymerization monomers, photoinitiators, coloring agents and fillers, wherein the binder polymer is polycarboxylic acid resin containing tetraphenolethane novolac type unsaturated group. The polycarboxylic acid resin containing tetraphenolethane novolac type unsaturated group is obtained by reacting tetraphenolethane novolac with epichlorohydrin; reacting the resultant with acrylic acid and reacting the resultant with polyvalent carboxylic acid or its anhydride. The polycarboxylic acid resin containing tetraphenolethane novolac type unsaturated group has an acid value of 30-190mgKOH/g and weight average molecular weight is 10,000-200,000. |
