| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that does not generate etching residues, when an inorganic insulating film coated with an organic insulating film is etched and suppressing the corrosion of copper and a copper alloy such as a metallic wiring, a metallic layer, or the like, to provide a manufacturing method for the semiconductor device, and to provide a photosensitive-resin composition and an electronic component. <P>SOLUTION: The semiconductor device has a semiconductor substrate 1 forming a pad electrode 2, the inorganic insulating film 3 formed on at least the pad electrode 2 and the first organic insulating film 4 formed on the inorganic insulating film 3. The first organic insulating film 4 is formed of a resin composition, containing a polyimide resin that does not contain fluorine in a resin structure, a heterocyclic compound and at least one compound selected from the compounds, having thioureas and a mercapto group. <P>COPYRIGHT: (C)2010,JPO&INPIT |
