发明名称 SURFACE PATTERNING AND VIA MANUFACTURING EMPLOYING CONTROLLED PRECIPITATIVE GROWTH
摘要 The present invention is concerned with a process of surface patterning and via manufacturing employing controlled precipitative growth, and patterned substrates prepared by such a process according to the present invention. A process according to the present invention comprises providing a substrate including at least one surface on which it is required to pattern a material, the surface including at least first and second surface regions having distinct surface properties and wherein the first surface region is further provided with protective precipitative growth thereon, and applying at least one material to at least the second surface region, such that the applied material is either substantially not provided to the first surface region, or if provided to the first surface region can be selectively removed therefrom.
申请公布号 US2009298296(A1) 申请公布日期 2009.12.03
申请号 US20050721487 申请日期 2005.12.12
申请人 KONINKLIJKE PHILIPS ELECTRONICS, N.V. 发明人 BURDINSKI DIRK
分类号 H01L21/302 主分类号 H01L21/302
代理机构 代理人
主权项
地址