| 摘要 |
<p>A support for cutting a silicon ingot of a solar cell is provided to improve the quality of a wafer by improving adhesive force between the silicon ingot and the support. A support is used for supporting a silicon ingot when cutting the silicon ingot for producing a silicon wafer for a solar cell. The support is made of epoxy of 20 - 30 weight%, reinforce filler of 50 - 60 weight%, hardener of 15 - 20 weight%, hardening additives of 1 - 3 weight%, and a special stabilizer of 0.5 - 1.5 weight%. The support has a plane(1) in contact with the silicon ingot. A fixing unit(3) is protruded to both sides of the plane.</p> |
