ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD

摘要

An electronic component mounting device comprises a backup member (6) for supporting the lower surface of a portion to which a TCP is pressure-bonded of a substrate; a pressure bonding tool (7) for pressure-bonding the TCP (5) to the upper surface of the portion supported by the backup member of the substrate by applying pressure; a cassette (12) having a supply shaft (23) wound with a sheet for supplying the sheet when rotationally driven by a supply motor and a take-up body (25) for taking up the sheet supplied from the supply shaft when rotationally driven by a take-up motor, with a portion of the sheet between the sheet supply shaft (23) and take-up body (25) placed between the TCP and the pressure bonding tool when the TCP is pressure-bonded to the substrate by the pressure bonding tool detachably provided to the body of the device; and a control unit for operating the supply motor to supply a predetermined length of the sheet from the supply shaft and then operating the take-up motor to take up the predetermined length of the sheet supplied from the supply shaft.