| 摘要 |
The method involves providing optical components, and receiving and placing the components on a glass wafer (13), where the component is a plane-parallel substrate and has spectrally filtered characteristics and ultraviolet (UV) and/or infrared (IR) blocking properties. The components are positioned either one by one or in groups relative to the position of associated optoelectronic or optical components of the wafer or the wafer to be connected with the components. An independent claim is also included for a method of packing an optoelectronic component. |
