发明名称 MULTILAYER FILM FOR PLATING, METHOD OF PREPARING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer film for plating capable of forming a metal film satisfactory in tight adhesion and superior in insulating reliability between patterns, a method of preparing metal film-coated material using the same, and a metal film-coated material. <P>SOLUTION: The multilayer film for plating is provided with a resin film and a plating receptive layer containing a polymer containing a function group and a polymerizable group forming mutual action with a plating catalyst or its precursor, or precursor thereof, wherein the plating receptive layer satisfies at least one of the following conditions 1-4. Condition 1: saturated water absorption ratio is 0.01-10 mass% in an environment of being a temperature of 25&deg;C and an relative humidity of 50%; condition 2: saturated water absorption ratio is 0.05-20 mass% in an environment of being a temperature of 25&deg;C and an relative humidity of 95%; condition 3: water absorption ratio after immersion in boiling water at 100&deg;C for one hour is 0.1-30 mass%; condition 4: in an environment of being a temperature of 25&deg;C and an relative humidity of 50%, surface contact angle after 5 &mu;L of distilled water is dropped onto the plating receptive layer and allowed to stand for 15 sec is 50-150 degrees. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009280905(A) 申请公布日期 2009.12.03
申请号 JP20090083044 申请日期 2009.03.30
申请人 FUJIFILM CORP 发明人 TSURUMI MITSUYUKI
分类号 C23C18/20;B32B27/00;C25D5/34;C25D5/56 主分类号 C23C18/20
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