发明名称 |
CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM |
摘要 |
A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1. |
申请公布号 |
WO2009126366(A3) |
申请公布日期 |
2009.12.03 |
申请号 |
WO2009US34058 |
申请日期 |
2009.02.13 |
申请人 |
WORLD PROPERTIES, INC.;BAARS, DIRK M.;PAUL, SANKAR |
发明人 |
BAARS, DIRK M.;PAUL, SANKAR |
分类号 |
H05K1/03 |
主分类号 |
H05K1/03 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|