| 摘要 |
<P>PROBLEM TO BE SOLVED: To avoid degradation in return loss caused by signal line wiring between electronic components, with a simple structure. <P>SOLUTION: In the connection structure of electronic components, a conductor 4 connects between signal lines 2a and 3a of a transfer path substrate 2 equipped with a GND part 2b on both sides of the signal line 2a and a semiconductor device 3 equipped with a GND part 3b on both sides of the signal line 3a. A separate conductor 5 connects the GND parts on both sides of the signal lines so that it straddles over the signal line at least at one of the transfer path substrate 2 and the semiconductor device 3. <P>COPYRIGHT: (C)2010,JPO&INPIT |
