| 摘要 |
<P>PROBLEM TO BE SOLVED: To not only obtain a double-sided heat dissipation structure but also obtain a high-precision form tolerance about a heat dissipating member even if a need of a step of removing resin burrs of molding resin and a step of obtaining the high-precision form tolerance is eliminated. <P>SOLUTION: A semiconductor device 1 includes: first and second semiconductor chips 5 and 6; a first heat dissipating member 9 electrically and thermally connected to rear surfaces 5a and 6a of respective semiconductor chips 5 and 6; a second heat dissipating member 10 electrically and thermally connected to front surfaces 5b and 6b of respective semiconductor chips 5 and 6; and a molding resin 11 sealing respective semiconductor chips 5 and 6 and the first and second heat dissipating members 9 and 10. The first and second heat dissipating members 9 and 10 are sealed with the molding resin 11 so that the first and second heat dissipating members 9 and 10 are exposed to both a first surface 3 and a second surface 4 of the semiconductor device 1. <P>COPYRIGHT: (C)2010,JPO&INPIT |
