| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic wiring board that exhibits high airtightness while having superior bonding strength between an insulating portion and a metallized portion, and to provide a method of manufacturing the same. <P>SOLUTION: The ceramic wiring board 1a includes: the insulating portion 10 made of alumina group ceramics; and the metallized portion 20 made of a molybdenum group conductive material arranged on a surface of the insulating portion and/or inside and burnt simultaneously. The alumina group ceramics has an MnO<SB>2</SB>-converted content C1<SB>Mn</SB>of Mn satisfying 0.5 mass x%≤C1<SB>Mn</SB>≤10 mass%, and the molybdenum group conductive material has an NiO-converted content C2<SB>Ni</SB>of Ni, an MnO<SB>2</SB>-converted content C2<SB>Mn</SB>of Mn, and an Al<SB>2</SB>O<SB>3</SB>-converted content C2<SB>Al</SB>of Al, satisfying 0.2 mass%≤C2<SB>Ni</SB>≤5 mass%, 0.1 mass%≤C2<SB>Mn</SB>≤10 mass%, and 10 mass%≤C2<SB>Al</SB>≤30 mass%. Also, the metahod of manufacturing the same is provided. <P>COPYRIGHT: (C)2010,JPO&INPIT |
