| 摘要 |
<P>PROBLEM TO BE SOLVED: To restrain generation of solder balls to secure electric bonding at low resistance, at the time of soldering. <P>SOLUTION: A conductive paste includes a filler component and a flux component. The filler component includes a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler is higher than that of the second conductive filler by 20°C. or more, the flux component includes a first flux and a second flux having different melting points, the melting point of the first flux is higher than that of the second flux, and the melting point of the first flux is higher than that of the second conductive filler by 15°C to 45°C. The melting point of the second flux is equal to or less than that of the second conductive filler. The conductive paste is excellent in preserving property at room temperature. <P>COPYRIGHT: (C)2010,JPO&INPIT |
