| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pressure sensor module that suppresses the variation in output characteristic of a pressure sensor by stress occurring in a laminated substrate and has a desired output characteristic. <P>SOLUTION: A pressure sensor module 30A (30) includes: the pressure sensor 10 which includes a cavity 13 which expands substantially in parallel with one face 11a of a semiconductor substrate 11 inside a center region α on the one face 11a, a diaphragm 14 which is defined by a thin-plate region positioned on one side of the cavity 13, a pressure-sensitive element 15 which is arranged at the diaphragm 14 and disposed on the one face 11a at a region β excluding the diaphragm 14, and at least a conductive section 16 which is electrically connected to the pressure-sensitive element 15; a bump 18 which is electrically connected to every conductive section 16; and the laminated substrate 20 which includes a wiring base material 21 electrically connected to the pressure sensor via the bump 18. The wiring base material 21 is disposed inside the laminated substrate 20, and at least a part of a face 21a of the wiring base material electrically connected to the bump 18 is exposed from the laminated substrate 20. <P>COPYRIGHT: (C)2010,JPO&INPIT |
