| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyimide precursor solution that can be cured at a low temperature (250°C or lower) and has a low viscosity although it has a high concentration, to provide a process for producing the polyimide precursor solution, to provide a polyimide coating film that is produced from the polyimide precursor solution and has good physical properties, to provide a photosensitive resin composition and to provide a process for producing the photosensitive resin composition. <P>SOLUTION: A polyimide precursor composition characterized by containing an imidized dicarboxylic acid having a specific structure and a diamine having a specific structure and/or an isocyanate compound is used to solve the problem. <P>COPYRIGHT: (C)2010,JPO&INPIT |
