| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting semiconductor element, capable of surely reducing the stress at a solder jointing part for improved connection with an electronic component mounting substrate and a semiconductor element, by suppressing the heating temperature, when mounting the semiconductor element on a resin substrate. SOLUTION: The semiconductor element mounting method comprises: a step, in which an Sn-Bi solder composition is supplied to an electrode part provided on a resin substrate for mounting an electronic component; a step in which an Sn-Ag solder ball is placed on the electrode part to which the Sn-Bi solder composition has been supplied; a step in which the semiconductor element is placed on the Sn-Ag solder ball, by aligning the electrode part of the semiconductor element to which the Sn-Bi solder composition has been supplied so as to face the position of the Sn-Ag solder ball; and a step in which the Sn-Bi solder composition on the resin substrate side and the semiconductor element side is melted, by heating at a temperature equal to or higher than the melting point of the Sn-Bi solder composition but lower than the melting point of the Sn-Ag solder ball, thus the semiconductor element is jointed to the resin substrate through the Sn-Ag solder ball. COPYRIGHT: (C)2010,JPO&INPIT
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