发明名称 |
Methods of Forming Conductive Features and Structures Thereof |
摘要 |
Methods of forming features and structures thereof are disclosed. In one embodiment, a method of forming a feature includes forming a first material over a workpiece, forming a first pattern for a lower portion of the feature in the first material, and filling the first pattern with a sacrificial material. A second material is formed over the first material and the sacrificial material, and a second pattern for an upper portion of the feature is formed in the second material. The sacrificial material is removed. The first pattern and the second pattern are filled with a third material.
|
申请公布号 |
US2009294986(A1) |
申请公布日期 |
2009.12.03 |
申请号 |
US20080129479 |
申请日期 |
2008.05.29 |
申请人 |
YAN JIANG;HAMPP ROLAND;HAN JIN-PING;ELLER MANFRED;GUTMANN ALOIS |
发明人 |
YAN JIANG;HAMPP ROLAND;HAN JIN-PING;ELLER MANFRED;GUTMANN ALOIS |
分类号 |
H01L23/52;H01L21/4763;H01L21/8238 |
主分类号 |
H01L23/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|