| 摘要 |
<p>Provided is an ultrasonic bonding apparatus which performs ultrasonic bonding wherein a chip component electrode is bonded to a substrate electrode by ultrasonic waves by applying ultrasonic oscillation to a chip component, which has, on one side, an electrode surface whereupon an electrode is formed and a rear surface to the electrode surface held by an ultrasonic horn by suction. The ultrasonic bonding apparatus is provided with a chip rear surface inspecting means for inspecting the rear surface of the chip component prior to holding the rear surface of the chip component by suction by the ultrasonic horn. The polishing cycle of the chip holding surface of the ultrasonic horn is long, and the service life of the ultrasonic horn is long.</p> |
