| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of automatically removing an adsorbing member used for a hole filling material for preventing air leakage of a component having a through-hole or the like in mounting various components on a printed board. <P>SOLUTION: This method used for peeling off an adsorbing member in mounting components on a printed board is characterized in that the adsorbing member attached only to each of specific components to respond to automatic mounting by a mounter is brought into a state easy to peel off after reflow by deforming its shape and degrading its adhesive function by heat in the reflow. <P>COPYRIGHT: (C)2010,JPO&INPIT |
