| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for achieving satisfactory quantity management and accurate failure analysis by easily testing the various characteristics of respective semiconductor elements against failure generation in a substrate mounting state when producing a semiconductor configured of a plurality of semiconductor elements. <P>SOLUTION: In the simplex state of a semiconductor device 30, a connection structure in which a plurality of semiconductor elements are electrically independent is presented so that it is possible to test and analyze various characteristics by individually supplying a power to each semiconductor element. In the state of a semiconductor device module 55 configured by mounting the semiconductor device 30, a connection structure configured of a parallel circuit configured of a plurality of semiconductor elements is presented so that it is possible to drive all the semiconductor elements by applying a voltage to a pair of electrode pads 44a and 44b for solder bonding formed on a substrate for mounting a semiconductor device. <P>COPYRIGHT: (C)2010,JPO&INPIT |
