| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition, which can attain not only developability, hardness, heat resistance, and sensitivity required for a solder resist, but also both superior plating resistance and storage stability, and to provide a photosensitive film, a photosensitive laminate, a permanent pattern forming method, and a printed board. <P>SOLUTION: The photosensitive composition includes a binder, a polymerizable compound, a photopolymerization initiator, a thermal crosslinking agent, and a compound represented by general formula (1), where in the formula (1), R<SB>1</SB>and R<SB>3</SB>are any of a hydrogen atom, a 1-12C alkyl group, and a 6-20C aryl group; R<SB>2</SB>is either of a hydrogen atom and an organic functional group; R<SB>1</SB>, R<SB>2</SB>, and R<SB>3</SB>may have a substituent; and Y is a hetero atom. <P>COPYRIGHT: (C)2010,JPO&INPIT |
