| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve such a problem of a conventional method of manufacturing a substrate with a built-in chip for performing inspections, such as, continuity tests with a completed substrate with a built-in chip. <P>SOLUTION: After forming a first multi-layer wiring board 12 on one surface side of a first metal plate 10 by a build-up method, the electrical connection between a second pad 20 and a first pad 14 making contact with the first metal plate 10, in correspondence with each of the second pads, is checked by a continuity test between the second pad 20 and the first metal plate 10. Then, the insulation of wiring patterns connected to the first pad 14 is checked by the continuity test between the first pads 14 and 14, that are exposed by peeling the first metal plate 10, after bonding the second metal plate via an insulating layer which covers the entire surface on the other surface side with the first multi-layer wiring board 12. After that, a semiconductor chip is mounted on one board of the first multi-layer wiring board 10 and the second multi-layer wiring board, after performing the continuity test, in a similar manner as to that with respect to the second multi-layer wiring board that is bonded to the first multi-layer wiring board 12. Then, the other board is laminated on the chip-mounting surface of the one board. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
