| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To surely inspect presence of defects on a circuit board, in a short time, and deposit a protective resin layer coating a circuit element, after the circuit element is incorporated only into the circuit board that is without defects. <P>SOLUTION: A manufacturing method includes steps of: arranging numerous circuit element mounting regions on the circuit board 1; forming numerous through-hole electrodes 16 around the regions; coating at least one end of the electrode 16 with resist 18; applying pressure to the circuit board 1 and measuring the change in pressure; detecting whether the defect, such as, a pin hole connecting with the through-hole electrode 16 exists on the resist layer, and incorporating the circuit element into the circuit board 1 without defects; and depositing the protective resin layer for coating the circuit element, thereby preventing the protective resin from flowing from the resist layer 18 into the through-hole electrode 16. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
