| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit capable of achieving high-speed ripping. SOLUTION: The semiconductor integrated circuit includes: a first encryption circuit encrypting data read from a first recording medium and recording resultant first encryption data on a preliminary recording medium; a first decryption circuit decrypting the first encryption data recorded on the preliminary recording medium and outputting the resultant data; a detection circuit causing the first encryption data recorded on the preliminary recording medium to be erased when it is prohibited to record the data onto a second recording medium on the basis of electronic watermark information included in the data and outputting the data input from the first decryption circuit when it is allowed to record the data on the second recording medium; an encoding circuit encoding the data output from the detection circuit and outputting the resultant encoded data; and a second encryption circuit encrypting the encoded data and recording the resultant second encryption data onto the second recording medium. COPYRIGHT: (C)2010,JPO&INPIT |
