发明名称 Optical Sensor Including Stacked Photosensitive Diodes
摘要 A complementary metal-oxide-semiconductor (CMOS) image sensor comprises a first photosensitive diode comprising a first semiconductor material is formed in a first semiconductor substrate. A second photosensitive diode comprising a second semiconductor material, which has a different light detection wavelength range than the first semiconductor material, is formed in a second semiconductor substrate. Semiconductor devices for holding and detecting charges comprising a sensing circuit of the CMOS image sensor may also be formed in the second semiconductor substrate. The first semiconductor substrate and the second semiconductor substrate are bonded so that the first photosensitive diode is located underneath the second photosensitive diode. The vertical stack of the first and second photosensitive diodes detects light in the combined detection wavelength range of the first and second semiconductor materials. Sensing devices may be shared between the first and second photosensitive diodes.
申请公布号 US2009294812(A1) 申请公布日期 2009.12.03
申请号 US20080129714 申请日期 2008.05.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GAMBINO JEFFREY P.;MAYNARD DANIEL N.;OGG KEVIN N.;RASSEL RICHARD J.;ROSNER RAYMOND J.
分类号 H01L27/146;H01L31/18 主分类号 H01L27/146
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