发明名称 |
METHOD AND APPARATUS FOR MEASURING DEFORMATION OF LAMINATED BODY |
摘要 |
There is provided a method of measuring deformation of a laminated body, the method including: laminating and pressurizing a plurality of green sheets each having a plurality of inner electrodes arranged therein to form a laminated body having a plurality of unit chips arranged therein; marking location information of each of the unit chips on an XY plane of the laminated body on a surface of the unit chip; cutting the laminated body into the plurality of unit chips; measuring a deformation level of each of the cut unit chips; and storing the deformation level measured from the each of the cut unit chips to correspond to the location information of the unit chip.
|
申请公布号 |
US2009296080(A1) |
申请公布日期 |
2009.12.03 |
申请号 |
US20090398462 |
申请日期 |
2009.03.05 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM DONG JIN;HA SUNG KYU;KIM HYO JUNG;KIM JU HO;OH DAE BOK;CHOI WON SEOP |
分类号 |
G01N21/00;B41J2/01;H01L21/66 |
主分类号 |
G01N21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|