发明名称 METHOD AND APPARATUS FOR MEASURING DEFORMATION OF LAMINATED BODY
摘要 There is provided a method of measuring deformation of a laminated body, the method including: laminating and pressurizing a plurality of green sheets each having a plurality of inner electrodes arranged therein to form a laminated body having a plurality of unit chips arranged therein; marking location information of each of the unit chips on an XY plane of the laminated body on a surface of the unit chip; cutting the laminated body into the plurality of unit chips; measuring a deformation level of each of the cut unit chips; and storing the deformation level measured from the each of the cut unit chips to correspond to the location information of the unit chip.
申请公布号 US2009296080(A1) 申请公布日期 2009.12.03
申请号 US20090398462 申请日期 2009.03.05
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM DONG JIN;HA SUNG KYU;KIM HYO JUNG;KIM JU HO;OH DAE BOK;CHOI WON SEOP
分类号 G01N21/00;B41J2/01;H01L21/66 主分类号 G01N21/00
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