| 摘要 |
The element has a carrier substrate (2) with a conductive power connection path. A high voltage LED (4) is arranged on a main side of the substrate, and is conductively connected with the path. A power cable (6) is conductively connected with the path, and has a cod grip at an end region (8) adjacent to the conductive connection with the path of the carrier substrate. A protective layer made of electrically isolating material e.g. silicon, is applied on the main side of the carrier substrate, where the protective layer covers all energized parts and the cord grip. An independent claim is also included for a method for manufacturing a lighting element. |
