| 摘要 |
<p>A heat absorbing member (322) is arranged on the first surface (321b) side of a printed substrate (321). A fan unit (324) is arranged on the second surface (321c) side which is the back surface of the first surface (321b) of the printed substrate (321). A heat dissipation structure (320) comprises a stud (323) which is a connection member which runs through the printed substrate (321) and comes into contact with the heat absorbing member (322) and the fan unit (324). The stud (323) extends from the heat absorbing member (322), runs through the printed substrate (321), and comes into contact with the fan unit (324) in a state in which the heat dissipation structure (320) is assembled. Heat generated by an electronic component is dissipated via the heat absorbing member (322) and can be dissipated by use of direct discharge from the fan unit (324).</p> |
