| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device for reducing a manufacturing cost by simplifying a manufacturing process. <P>SOLUTION: The electronic device 10 includes a first electronic component 17 requiring a predetermined heat capacity when reflow-mounting, a second electronic component 18 with a lower heat-resistant temperature than a temperature satisfying the heat capacity necessary for mounting the first electronic component, a circuit board 11 equipped with a first pad and a second pad on a first surface 12A on a base material 12 formed in a plane for surface-mounting the first and second electronic components, and a through via 19 passing from the first surface through a second surface 12B and having thermal conductivity higher than that of the base material. The through via 19 is connected with the first pad on the first surface. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
