发明名称 METHOD FOR CUTTING STACKED BODY
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cutting treatment for a stacked body in which a brittle material substrate and a resin film are stacked, wherein waste such as peeling pieces and cutting pieces is not produced, and the surface of the brittle material substrate is prevented from being damaged. <P>SOLUTION: In a glass substrate 3, from the side face opposite to the side of a resin film face, a crack 5 in the range of 10 to <100% of the thickness of the glass substrate 3 is formed in the almost vertical direction to the glass substrate face. Next, a cutter 2 is brought into press contact in the position at which the crack 5 is elongated in the surface of the resin film 41 or the vicinity thereof, so that the cutter 2 is relatively moved to the stacked body S1, and a notch 6 is made at≥90% to the thickness of the resin film 41 also to the range at which it does not reach the glass substrate 3. In this way, the stacked body S1 is cut. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009280447(A) 申请公布日期 2009.12.03
申请号 JP20080134887 申请日期 2008.05.23
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 MAEKAWA KAZUYA
分类号 C03B33/07;B28D5/00;B32B37/00 主分类号 C03B33/07
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