发明名称 PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment device can increase a filling rate of discharge parts into a chamber. <P>SOLUTION: This is equipped with a reaction chamber R, a gas introduction part 1a to introduce a reaction gas, an exhaust part 6 to exhaust the reaction gas G1, three sets or more of the discharge parts 3 opposedly arranged and consisting of a set of a first electrode 1 and a second electrode 2, a support means 5 to support and juxtapose respective sets of the first electrode 1 and the second electrode 2, and a power supply part E to supply electric power to all the sets of the discharge parts 3. The power supply part E is equipped with a high frequency wave generator, and an amplifier to amplify a high frequency wave electric power from the high frequency wave generator, and to supply the power to the first electrode 1, and out of all sets of the discharge parts 3, the first electrode 1 of one discharge part 3 and the first electrode 1 of the other neighboring discharge part 3 are respectively connected via the individual amplifier to the same high frequency wave generator, or respectively connected via the amplifier to a different high frequency wave generator, and a plurality of the second electrodes 2 are respectively grounded. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009283235(A) 申请公布日期 2009.12.03
申请号 JP20080133073 申请日期 2008.05.21
申请人 SHARP CORP 发明人 KISHIMOTO KATSUSHI;FUKUOKA YUSUKE
分类号 H05H1/46;C23C16/509;H01L21/205;H01L21/3065 主分类号 H05H1/46
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