| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a device composed of a physically-different low-dimensional structure on a receiving substrate. SOLUTION: The method includes a step of forming elongate structures 5 on the first substrate 3 so that first and second sections are formed in the elongate structure by changing respective material compositions of a plurality of elongate structures 7 along the lengthwise direction. Physically-different first and second devices 1, 2 are formed in the elongate structure. The physically-different first and second sections can be formed in the elongate structure after the first and second sections are manufactured. The elongate structure can be encapsulated and transferred to a second substrate 7. A formation method for a circuit board in which the physically-different first and second devices 1, 2 are needed to be arranged on a common substrate can be improved. Especially, a transfer process is needed one time only. COPYRIGHT: (C)2010,JPO&INPIT |
