| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding apparatus and bonding method for electronic parts capable of detecting an action amplitude of a scrubbing action in bonding electronic parts by a simple method without causing the increase of equipment costs. SOLUTION: This bonding apparatus detects an action amplitude of a scrubbing action reciprocating an electronic part held on a bonding head is in a horizontal direction relative to a substrate in a predetermined action amplitude, wherein a target mark, which is located so as to be capable of being imaged and is relatively moved in a horizontal direction relative to an imaging part 14 by a bonding mechanism 8 or an XY table 3, is imaged by the imaging part 14 equipped with a substrate imaging camera 14b for imaging the substrate and a parts imaging camera 14a for imaging electronic parts, and the imaging result is subjected to recognition processing by a recognition processing part 21. Thus, by making active use of the existing function of the bonding apparatus, the bonding apparatus detects the action amplitude of the scrubbing action. COPYRIGHT: (C)2010,JPO&INPIT |
