发明名称 |
Semiconductor package device, semiconductor package structure, and fabrication methods thereof |
摘要 |
A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.
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申请公布号 |
US2009294959(A1) |
申请公布日期 |
2009.12.03 |
申请号 |
US20080315787 |
申请日期 |
2008.12.04 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
CHIANG CHENG-CHIA;CHANG CHIN-HUANG;HUANG CHIEN-PING;HUANG CHIH-MING;HUANG JUNG-PIN |
分类号 |
H01L23/522;H01L23/28;H01L23/31;H01L23/532 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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