发明名称 |
INTEGRATED CIRCUIT HAVING LOCALIZED EMBEDDED SiGe AND METHOD OF MANUFACTURING |
摘要 |
An integrated circuit (IC) with localized SiGe embedded in a substrate and a method of manufacturing the IC is provided. The method includes forming recesses in a substrate on each side of a gate structure and remote from a shallow trench isolation structure. The method further includes growing a stress material within the recesses such that the stress material is bounded on its side only by the substrate.
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申请公布号 |
US2009294894(A1) |
申请公布日期 |
2009.12.03 |
申请号 |
US20080127887 |
申请日期 |
2008.05.28 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DYER THOMAS W. |
分类号 |
H01L29/00;H01L21/76 |
主分类号 |
H01L29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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