发明名称 INTEGRATED CIRCUIT HAVING LOCALIZED EMBEDDED SiGe AND METHOD OF MANUFACTURING
摘要 An integrated circuit (IC) with localized SiGe embedded in a substrate and a method of manufacturing the IC is provided. The method includes forming recesses in a substrate on each side of a gate structure and remote from a shallow trench isolation structure. The method further includes growing a stress material within the recesses such that the stress material is bounded on its side only by the substrate.
申请公布号 US2009294894(A1) 申请公布日期 2009.12.03
申请号 US20080127887 申请日期 2008.05.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DYER THOMAS W.
分类号 H01L29/00;H01L21/76 主分类号 H01L29/00
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