MOISTURE-CURING HOT-MELT ADHESIVE

摘要

Provided is a moisture-curing hot-melt adhesive which has an excellent solidifying performance with a lowering in temperature, shows a small shrinkage at solidification, sustains the surface uniformity of a thus obtained laminate after the completion of the solidification, and causes no damage on the cutting properties of the laminate.  A moisture-curing hot-melt adhesive which is a moisture-curing hot-melt adhesive containing a urethane polymer having a terminal isocyanate group, wherein the urethane polymer has a bisphenol structure and a chemical structure derived from an aliphatic dicarboxylic acid having 10 to 18 carbon atoms.  A laminate can be appropriately produced by bonding a decorative material to a base material with the use of the moisture-curing hot-melt adhesive as described above.  The laminate thus obtained can be preferably usable as an IC card and so on.