发明名称 METHOD FOR DETECTING POLISHING END POINT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for stably and accurately detecting a polishing end point, wherein a desired film thickness is a polishing end point, in a predetermined film regardless of a difference in an initial film thickness, without being affected by slurry or the like. <P>SOLUTION: The method includes: a first step of making reflected light from the predetermined film spectral for each wavelength; a second step of converting the reflected light into a reflectance for each wavelength; a third step of calculating the amount of a change in the reflectance in each standard wavelength width respectively; a fourth step of averaging the amount of a change in each reflectance over an evaluation wavelength range to determine an average value of the variability of the reflectance for each fixed wavelength area; and a fifth step of detecting the polishing end point based on peculiar changes P and Q which occur in an average value wave form of the variability of the reflectance for each fixed wavelength area with progress in polishing. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009283868(A) 申请公布日期 2009.12.03
申请号 JP20080137114 申请日期 2008.05.26
申请人 TOKYO SEIMITSU CO LTD 发明人 YANAI AKIO;MATSUSHITA OSAMU;FUJITA TAKASHI
分类号 H01L21/304;B24B37/013 主分类号 H01L21/304
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