| 摘要 |
PROBLEM TO BE SOLVED: To provide an coating/development apparatus capable of improving accuracy of pattern information in obtaining the pattern information including the line width of a resist pattern. SOLUTION: This coating/development apparatus is structured to include: a means obtaining a film thickness distribution of a base film in a substrate surface in accordance with a processing parameter in forming the base film; a means acquiring a light intensity distribution showing a relationship between the wavelength and light intensity of light received by a light reception part receiving light reflected from an emission region of a light emission part; a storage part where data with pattern information of a resist pattern, the film thickness of the base film, and the light intensity distribution related to one another are stored; and a means obtaining the film thickness of the base film at the light emission position of the light emission part from the film thickness distribution, and obtaining pattern information corresponding to the film thickness of the base film and the obtained light intensity distribution based on the data. Thus, measurement error of a pattern shape due to the film thickness distribution is suppressed. COPYRIGHT: (C)2010,JPO&INPIT |
