| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-throughput alignment detection system without requiring preceding confirmation measurement in fine alignment of an original plate or a substrate; and an exposure apparatus having the alignment detection system. <P>SOLUTION: This alignment detection system includes: an illumination optical system irradiating an inspection object with illumination light; and an imaging optical system including a first optical system collecting reflected light reflected from the inspection object to form an image of the inspection object of first imaging magnification, a second optical system forming an image of the inspection object of second imaging magnification higher than the first imaging magnification, a changeover means changing over the first optical system to the second optical system and vice versa, a first image detection means subjecting the image of the first imaging magnification to photoelectric conversion, and a second image detection means subjecting the image of the second imaging magnification to photoelectric conversion. The alignment detection system is characterized by executing second measurement in the visual field of the image of the second imaging magnification based on information of first measurement in the visual field of the image of the first imaging magnification. <P>COPYRIGHT: (C)2010,JPO&INPIT |
