| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which allows a part of a plurality of semiconductor modules, which constitute the semiconductor device, to be replaced and repaired. SOLUTION: A semiconductor device 10 includes semiconductor modules 20 having heat radiating fins 28 arranged symmetrically on both sides of semiconductor elements 22, and a cooler 50 having a coolant flow passage 52 formed therein and includes the cooling fins 28 disposed in the coolant flow passage 52 with the semiconductor modules 20 mounted in the cooler 50, and a plurality of semiconductor modules 20 are attached to and removed from the cooler 50. COPYRIGHT: (C)2010,JPO&INPIT |
