| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a microstructural body applicable for use in an anisotropic conductive member and composed of an insulative base material having micro-pore through-holes into which metal is filled up at a high filling ratio, and to provide a method of manufacturing the same. <P>SOLUTION: The microstructural body is composed of an insulative base material having micro-pore through-holes of pore diameters 10 to 500 nm in a density of 1×10<SP>6</SP>to 10<SP>10</SP>/mm<SP>2</SP>, and metal is filled up inside the micro-pore through-holes at a filling ratio of 80% or more. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
