发明名称 |
BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING |
摘要 |
There is described a hybrid bonding method for through-silicon-via based wafer stacking. Patterned adhesive layers are provided to join together adjacent wafers in the stack, while solder bondng is used to electrically connect the vias. The adhesive layers are patterned to enable outgassing and to provide stress relief. |
申请公布号 |
US2009294916(A1) |
申请公布日期 |
2009.12.03 |
申请号 |
US20080131788 |
申请日期 |
2008.06.02 |
申请人 |
HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCHINSTITUTE COMPANY, LTD. |
发明人 |
MA WEI;SHI XUNQING;CHUNG CHANG HWA |
分类号 |
H01L23/538;H01L21/50 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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